#پیام_ناشناس
🔔سؤال: سلام استاد. ممنون بابت وقتی که میذارید. یه استادی خیلی کار دانشجوی قبلیش شبیه به کار ارشد من هست که توی مقاله آخرش به یه مشکلی اشاره کرده. من خواستم بهش توی ایمیل بگم این مشکل رو من اینجوری بهبود دادم. اما احساس میکنم ایمیلم طولانی هست خیلی. ممنون میشم نظرتون رو بگید.
Dear Dr. ...,
I am an M.Sc. graduate in
*, with a 4.0 GPA (****/20).
After exploring your google scholar profile and glancing at your recent publications, I have found your projects greatly coincide with my research interest and background. Regarding your worthwhile research on SOFCs, in which I am highly interested, I will be proud if I can continue my career as a Ph.D. student in your research group.
During my masters program, I worked on the Cu-Mn spinel coating for SOFC interconnects. As as you mentioned in your recent paper, these spinel coatings tend to buckle. Also, the adhesion to the substrate is not good enough. In my study, the cause of blistering defect was identified by determining the conversion mechanism of metallic layers to the spinel. My results showed that deposition of nickel strike before copper electroplating not only improved the adhesion of the coating to the substrate, but decreased the buckling damage of the coating during oxidation.
With respect, I uploaded my CV and Transcript to this email. I would be glad to schedule a meeting to further discuss my research qualifications elaborately.
Looking forward to hearing from you.
Kind regards,
T.me/safarname7✅جواب: سلام. این زیر اصلاحش کردم گذاشتم:
After exploring your google scholar profile and
reading your recent publications, I have
realized your
ongoing research coincide with my research interests. Given your research on SOFCs, in which I am highly interested,
I would like to explore potential opportunities to join your group as a Ph.D. student.During my masters thesis, I worked on the Cu-Mn spinel coating for SOFC interconnects. As you mentioned in your recent paper, these spinel coatings tend to buckle. Also, the adhesion to the substrate is not
optimal enough. In my
research, the cause of blistering defect was identified by determining the conversion mechanism of metallic layers to the spinel.
Our results showed that deposition of nickel strike before copper electroplating, not only improved the adhesion of the coating to the substrate, but
also decreased the buckling damage of the coating during oxidation.
I have uploaded my CV and Transcript to this email. I would be glad to schedule a meeting to further discuss my
application to join your group.
موفق باشید🎓
T.me/safarname7